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DeepCool AK620 High Performance Dual Tower CPU Cooler, 6 Copper Heat Pipes, 2x 120 FDB Fans, 260W Heat Dissipation LGA2066/2011-v3/1200/1511/1700
$149.00
60 in stock
LGA 1700 Bracket Included DeepCool AK620 High Performance CPU Cooler equipped with six copper heat pipes stacked with a dense dual-tower fin array and two 120 FDB fans. Achieve peak performance on your CPU with substantial cooling capacity for high frequency overclocking. The AK620 features a maximum heat dissipation power of 260W and improved airflow to lower temperatures during demanding system applications. EXCEPTIONAL COOLING BY DESIGN The AK620 features a precision-machined convex copper base and six copper heat pipes that deliver improved heat transfer capabilities. The dense matrix fin array in a dual tower heat sink layout offers better efficiency for high performance systems. Application For Intel LGA 2066/2011-v3/82011/1200/1151/1150/1155/1700 AMD AM5/AM4 Technical Spec Product Dimensions 129×138×160 mm Heatsink Dimensions 127×110×157 mm Net Weight 1456 g Heatpipe Ø6 mm×6 pcs Fan Dimensions 120×120×25 mm Fan Speed 500~1850 RPM±10% Fan Airflow 68.99 CFM Fan Air Pressure 2.19 mmAq Fan Noise ≤28 dB(A) Fan Connector 4-pin PWM Bearing Type Fluid Dynamic Bearing Fan Rated Voltage 12 VDC Fan Rated Current 0.12 A Fan Power Consumption 1.44 W EAN 6933412727316 P/N R-AK620-BKNNMT-G
Weight | 1.74 g |
---|---|
Dimensions | 191 × 156 × 221 mm |
Warranty | |
Barcode |
If you feel your product has failed a Consumer Guarantee (as defined by Australian Consumer Law) then you can:
LGA 1700 Bracket Included
DeepCool AK620 High Performance CPU Cooler equipped with six copper heat pipes stacked with a dense dual-tower fin array and two 120 FDB fans.
Achieve peak performance on your CPU with substantial cooling capacity for high frequency overclocking.
The AK620 features a maximum heat dissipation power of 260W and improved airflow to lower temperatures during demanding system applications.
EXCEPTIONAL COOLING BY DESIGN The AK620 features a precision-machined convex copper base and six copper heat pipes that deliver improved heat transfer capabilities. The dense matrix fin array in a dual tower heat sink layout offers better efficiency for high performance systems.
Application For
Intel LGA 2066/2011-v3/82011/1200/1151/1150/1155/1700
AMD AM5/AM4
Technical Spec
Product Dimensions 129×138×160 mm
Heatsink Dimensions 127×110×157 mm
Net Weight 1456 g
Heatpipe Ø6 mm×6 pcs
Fan Dimensions 120×120×25 mm
Fan Speed 500~1850 RPM±10%
Fan Airflow 68.99 CFM
Fan Air Pressure 2.19 mmAq
Fan Noise ≤28 dB(A)
Fan Connector 4-pin PWM
Bearing Type Fluid Dynamic Bearing
Fan Rated Voltage 12 VDC
Fan Rated Current 0.12 A
Fan Power Consumption 1.44 W
EAN 6933412727316
P/N R-AK620-BKNNMT-G
Weight | 1.74 g |
---|---|
Dimensions | 191 × 156 × 221 mm |
Warranty | |
Barcode |
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